History

Successfully developed the High Speed Copper Plating Equipment (HSP) which is a penetrating tool for ABF substrate, RDL and Copper pillar,etc.

Expanded the requirement of ABF substrate panel as well as equipment. The annual turnover increased 40% more than 2020.

Contruction of solar energy green power at Dong Long factory has been completed.

Completed construction and startup of new Dong Long Headquarter.

Successfully developed Standard Vertical Continuous Copper Plating Equipment (SVCP) and went into mass production.

Successfully developed and sold U-turn Vertical Continuous Copper Plating Equipment (UVCP) using frame and 6 axis robot for automatic loading specially for extra thin board and fine lines pattern applying to process of CSP and FLIP CHIP, etc.

 

Successfully developed Reel to Reel Vertical Continuous Copper Plating Equipment (RVCP) specially for flexible panel. Pass new ISO9001 2008 certification.

 

Built up Double Track Vertical Continuous Copper Plating Equipment (DVCP) and went into mass production.

Successfully introduced via filling process into HDI, BGA, PBGA, FLIP CHIP and CSP, etc. on Vertical Continuous Copper Plating Equipment (VCP).

ISO9001: 2000 certified. Established Suzhou factory.

Developed Vertical Continuous Copper Plating Equipment (VCP).

Developed Horizontal Continuous Plating Equipment (HCP). Set up R & D center and laboratory.

Developed and sold 1st Flip Chip plating equipment to customer.

New headquarter with area of  7,350M².

Obtained the HDI technology and applied to Osaka and Vietnam factory of Japan Fujitzu Circuit Ltd.. 100% growth more than 1996.

Expanded overseas markets and got orders from NEC Philippines factory.

Designed PCB automatic loading/unloading mechanism and obtained patents.

Concentrated on developing and manufacturing PCB plating equipment.

Established and engaged in metal plating equipment in Taiwan.