Standard Vertical Continuous Copper Plating Equipment (SVCP)

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PRODUCT
PRODUCT Standard Vertical Continuous Copper Plating Equipment (SVCP)

Standard Vertical Continuous Copper Plating Equipment (SVCP)

Product Description

This machine is applied for process of panel plating without auxiliary frame and jig for running board thickness 0.134 to 2.0 mm during production. Standardized design may lower the cost, shorten delivery time.
It gets remarkable performance for throwing power of high aspect ratio for through hole, blind via and via filling plating.

Products application:
Class A:
Auto load/unload with insoluble anode
Panel plating for MB board, motor board, HDI through/blind/via filling.
Class B:
Auto load/unload with soluble anode
Panel plating for MB board, motor board, HDI through/blind via plating.
Class C:
Manual load/unload with soluble anode
Flexible panel through/blind via plating with frame.
Specification

SPECIFICATION 

  ◆ Panel size:  24” x 24” (max.); 16” x 14” (min.)

  ◆ Board thickness: 0.1 + Cu foil H/H ~ 4.0 mm

  ◆ Line speed: 0.3 ~ 1.5 m/min (adjustable) 

  ◆ Plating window: 610 (810) x 5280 mm/Chamber 

  ◆ Current density: 30ASF (max.) with soluble anode

                                 40ASF (max.) with insoluble anode

  ◆ Anode: Soluble copper ball in Ti basket or insoluble anode (Ti mesh with IrO2 coating) 

  ◆ Cathode: Vertical clamping system

More info.
Specification

SPECIFICATION 

  ◆ Panel size:  24” x 24” (max.); 16” x 14” (min.)

  ◆ Board thickness: 0.1 + Cu foil H/H ~ 4.0 mm

  ◆ Line speed: 0.3 ~ 1.5 m/min (adjustable) 

  ◆ Plating window: 610 (810) x 5280 mm/Chamber 

  ◆ Current density: 30ASF (max.) with soluble anode

                                 40ASF (max.) with insoluble anode

  ◆ Anode: Soluble copper ball in Ti basket or insoluble anode (Ti mesh with IrO2 coating) 

  ◆ Cathode: Vertical clamping system

More info.
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