U-turn Vertical Continuous Copper Plating Equipment (Double type) (UVCP-DT)

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PRODUCT U-turn Vertical Continuous Copper Plating Equipment (Double type) (UVCP-DT)

U-turn Vertical Continuous Copper Plating Equipment (Double type) (UVCP-DT)

Product Description

Its design is specially for FC BGA, CSP, FC CSP, SAP and MSAP, etc. It can be linked with Sn plating. Double track design will increase double capacity more than UVCP but engage less floor space. Loading system coordinated with 6 axis robot and CCD to detect panel edges for accurate loading. Fixed frame is to assist production and avoid contacting patterns.
It gets remarkable performance for throwing power of high aspect ratio for via filling, through hole filing plating on extra fine pattern of thin board.

Products application:
PCB of 3C products, CPU of computer, GPU chip and Substrate-Like PCB, SLP, etc.
Specification

SPECIFICATION

    ◆ Panel size : Frame with one fixed size                      

    ◆ Board thickness : 0.046 ~ 4.0 mm  

    ◆ Line speed : 0.2 ~ 0.7 m/min (adjustable)  

    ◆ Plating window : 610 x 5280 mm/Chamber    

    ◆ Current density : 30 ASF (max.) for DC Rectifier   

    ◆ Anode : Insoluble anode (Ti mesh with IrO2 coating)          

    ◆ Cathode : Double track continuous transportation

 

More info.
Specification

SPECIFICATION

    ◆ Panel size : Frame with one fixed size                      

    ◆ Board thickness : 0.046 ~ 4.0 mm  

    ◆ Line speed : 0.2 ~ 0.7 m/min (adjustable)  

    ◆ Plating window : 610 x 5280 mm/Chamber    

    ◆ Current density : 30 ASF (max.) for DC Rectifier   

    ◆ Anode : Insoluble anode (Ti mesh with IrO2 coating)          

    ◆ Cathode : Double track continuous transportation

 

More info.
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