Double Track Vertical Continuous Copper Plating Equipment (DVCP)

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PRODUCT Double Track Vertical Continuous Copper Plating Equipment (DVCP)

Double Track Vertical Continuous Copper Plating Equipment (DVCP)

Product Description

This machine is applied for process of panel plating. Double track design can increase capacity. Its design is to replace conventional equipment, engages less floor space and solves problems of chemical contamination. It gets remarkable performance for throwing power of high aspect ratio for through hole, blind via and via filling on PCB.

Products application:
PCB of home appliances, MB PCB, HDI PCB of 3C products, automotive board, etc.
Specification

SPECIFICATION

   ◆ Panel size : A. 24” x 24” (max.); 18” x 16” (min.) (Standard)

                          B. 28” x 24” (max.); 22” x 16” (min.) (Option)
                          C. 32” x 24” (max.); 26” x 16” (min.) (Option)

   ◆ Board thickness : 0.134 ~ 2.0 mm   

   ◆ Line speed : 0.2 ~ 0.8 m/min (Adjustable)  

   ◆ Plating window : 610 (710)(810) x 5280 (mm)/Chamber x 2 tracks

   ◆ Current Density: 30 ASF (max.)      

   ◆ Anode : Soluble copper ball in basket or Insoluble anode (Ti mesh with IrO2 coating)

   ◆ Cathode : Single flight bar dual track clamping system

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Specification

SPECIFICATION

   ◆ Panel size : A. 24” x 24” (max.); 18” x 16” (min.) (Standard)

                          B. 28” x 24” (max.); 22” x 16” (min.) (Option)
                          C. 32” x 24” (max.); 26” x 16” (min.) (Option)

   ◆ Board thickness : 0.134 ~ 2.0 mm   

   ◆ Line speed : 0.2 ~ 0.8 m/min (Adjustable)  

   ◆ Plating window : 610 (710)(810) x 5280 (mm)/Chamber x 2 tracks

   ◆ Current Density: 30 ASF (max.)      

   ◆ Anode : Soluble copper ball in basket or Insoluble anode (Ti mesh with IrO2 coating)

   ◆ Cathode : Single flight bar dual track clamping system

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