Vertical Continuous Copper Plating Equipment (VCP)

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PRODUCT
PRODUCT Vertical Continuous Copper Plating Equipment (VCP)

Vertical Continuous Copper Plating Equipment (VCP)

Product Description

It's suitable for PCB of panel plating, pattern plating with board thickness at 0.06mm to 2.0mm without auxiliary frame or jig.
It has remarkable performance of throwing power for processes of through hole, blind via, via filling and through hole filling plating.

Products application:
PCB of 3C products (HDI, Substrate-Like PCB, SLP of MP), automotive board, IC substrate (FC CSP, FC BGA, flexible panel (FPC), etc).
Specification

SPECIFICATION

  ◆ Panel size: 24” x 24” (max.); 16” x 14” (min.) (Standard)

                        32” x 24” (max.); 24” x 14” (min.) (Option)

  ◆ Board thickness: 0.046 ~ 6.0 mm

  ◆ Line speed: 0.3 ~ 1.5 m/min (adjustable)

  ◆ Plating window: 610 (810) x 4800 mm/Chamber

  ◆ Current density: 40 ASF (max.) for DC Rectifier

                                  80 ASF (max.) for PPR Rectifier

  ◆ Anode: Insoluble anode (Ti mesh with IrO2 coating)

  ◆ Cathode: Vertical clamping system

More info.
Specification

SPECIFICATION

  ◆ Panel size: 24” x 24” (max.); 16” x 14” (min.) (Standard)

                        32” x 24” (max.); 24” x 14” (min.) (Option)

  ◆ Board thickness: 0.046 ~ 6.0 mm

  ◆ Line speed: 0.3 ~ 1.5 m/min (adjustable)

  ◆ Plating window: 610 (810) x 4800 mm/Chamber

  ◆ Current density: 40 ASF (max.) for DC Rectifier

                                  80 ASF (max.) for PPR Rectifier

  ◆ Anode: Insoluble anode (Ti mesh with IrO2 coating)

  ◆ Cathode: Vertical clamping system

More info.
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